The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. A high resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at https://www.masterbond.com/newsrelease/supreme-3dm-85. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE One Part, Toughened Epoxy for Dam-and-Fill Encapsulation Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures for curing. The fact that it is not premixed and frozen gives it an advantage in production situations where freezer storage may not be practical. Also, there are no special shipping requirements,” says Senior Product Engineer Rohit Ramnath. As a toughened system, Supreme 3DM-85 resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m·K)]. It plays an important role in facilitating effective heat dissipation and preventing overheating, especially in densely packed electronic assemblies. The epoxy maintains a Shore D hardness of 75-85, offers excellent damp heat resistance and has a good physical strength profile. Supreme 3DM-85 forms strong bonds with an extensive range of substrates commonly found in electronics and semiconductors. Substrates include metals, composites, ceramics, silicon, and a wide array of plastics. As a single part system, it is easy to handle and offers unlimited working life at room temperature. It is opaque black in color and can be applied manually or automatically. Serviceable from -100°F to +350°F [-73°C to +177°C], Supreme 3DM-85 is available for use in syringes and jars. Master Bond Adhesives for the Electronics Industry Supreme 3DM-85 is a toughened, one part system developed as a damming compound for dam-and-fill encapsulation. It is also useful for bonding and sealing purposes, where heat curing above 200°F is not possible. Read more about Master Bond’s specialized adhesives for the assembly of electronic devices at https://www.masterbond.com/industries/adhesives-assembly-electronic-devices or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com. Note to Editors: For a full product description, please visit: https://www.masterbond.com/tds/supreme-3dm-85 Check out new videos on our YouTube channel: https://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #