One Component, Thermally Conductive, Electrically Isolating, Room Temperature Curing, Non-Corrosive Silicone for High Performance Bonding, Sealing & Coating
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing Featuring Fast-Curing and Low Viscosity. Ideal for Smaller Encapsulations and Conformal Coatings.
Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Flowable, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures.
Two Component, Room Temperature Curing, Stainless Steel Filled Epoxy Resin System for Repair, Rebuilding, Restoring and Resealing of Worn or Damaged Metallic Components and High Compressive Strength Bonding of Carbide to Steel
One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Electrically Insulating Epoxy Featuring Excellent Bonding and Physical Strength Properties, Along with a Superior Ability to Withstand Thermal Cycling. Cryogenically Serviceable. Requires Oven Curing.
