One and two component liquid bonding, sealing, coating and potting compounds feature impressive physical strength properties and easy convenient dispensing. Designed to meet specific end use requirements these self leveling compounds are available in a range of viscosities. They provide users easy flowability and can be applied manually, semi-automatically or automatically. Both filled and unfilled systems offer the rheological characteristics essential for accurate, repeatable process control. Medium viscosity products conform to part geometry, assembly speed to maintain consistent uniform bond line thickness. Manufacturers are assured of high quality performance.
Most Popular Medium Viscosity Adhesives, Sealants, Coatings, Potting/Encapsulation Compounds
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EP30HT High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values. |
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MasterSil 800 Ultra high temperature resistance up to 300°C. Superb flexibility and elasticity. Non-corrosive. One component, room temperature curing. Flowable. |
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LED401LV One part, low viscosity, optically clear system. Fast curing with a high bond strength. Superior dimensional stability and electrical insulative properties. Serviceable from -60°F to +250°F. |
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EP3HTFL Heat resistant, flexibilized one component epoxy resin system. Superior physical strength properties. Inert to water and chemicals. Provides protection against rigorous thermal cycling and mechanical stress. Serviceable from -60°C to +175°C. |
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Supreme 11HTLV High peel and shear strength system. Convenient one to one mix ratio. Serviceable from -100°F to +350°F. Superior resistance to impact, thermal shock, vibration and stress fatigue cracking. Excellent toughness. Cures readily at room temperature. User friendly. Dependable dimensional stability. Readily machinable. |
