Hard, rigid curing adhesives, sealants and coatings offer high physical strength properties. They are commonly employed in many structural bonding applications. These systems cure at room temperature, upon exposure to heat or exposure to UV light.
Key Benefits of Master Bond's Rigid Curing Compounds
Master Bond's rigid curing compounds are designed to offer outstanding performance in harsh environments. Advantages of this type of system includes:
- High tensile and tensile shear strength
- Wear resistance
- Dimensional stability
- Exceptional compressive strength
- High glass transition temperature (Tg)
- Superior chemical resistant properties
Products exhibit Shore D hardness ranging from 70-90. One and two component epoxy formulations are solvent free and are available for use in low, medium and high viscosities. They have excellent bond strength to a wide variety of substrates including metals, glass, ceramics. Select grades contain specific fillers such as quartz, silicon carbide, alumina, or nickel to boost rigidity. These compounds are also noted for providing enhanced erosion/corrosion protection, resistance to wear/abrasion and low shrinkage upon cure. Heat curing these systems will increase cross linking density which will improve their rigidity and processing speed.
The chart below illustrates Shore D hardness and compressive strength values that can be achieved for select systems:
| System Type | Product | Shore D Hardness, 75°F | Compressive Strength, 75°F |
|---|---|---|---|
| Two part epoxy | EP30TC | 85-95 | 24,000-26,000 psi |
| Two part epoxy | EP30NS | 80-90 | 18,000-20,000 psi |
| Two part epoxy | EP21TCHT-1 | 85-95 | 22,000-24,000 psi |
| Two part epoxy | EP21SC-1 | 90-95 | 24,000-26,000 psi |
| Two part epoxy | Supreme 45HTQ | 80-90 | 22,000-24,000 psi |
| Two part epoxy | EP21AOLV-2Med | >80 | 22,000-25,000 psi |
| Two part epoxy | EP121AO | 85-90 | 24,000-26,000 psi |
Most Popular Rigid Curing Adhesive Systems
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EP30QF Quartz filled epoxy system. Features high tensile modulus, outstanding compressive strength and superior dimensional stability. Good flow properties. Suitable for potting/encapsulation. Reliable electrical insulator. Low CTE. Service temperature range from -60°F to +250°F. Excellent chemical resistance. Meets NASA low outgassing specifications. Withstands 1,000 hours at 85°C/85% RH. |
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EP30-2 Cryogenically serviceable. NASA low outgassing approved. 100% reactive. Excellent light transmission properties. Outstanding dimensional stability. High tensile and compressive strength. Successfully tested for 1,000 hours 85°C/85% RH. Excellent dielectric properties. Serviceable from 4k to +300°F. |
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EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
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EP21SC-1 High performance, abrasion resistant epoxy system. Silicon carbide filled compound. Convenient one to one mix ratio. Resists thermal cycling and many chemicals. Exceptional bond strength. Low coefficient of thermal expansion. Excellent electrical insulation properties. Paste consistency. Serviceable from -60°F to 250°F. |
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UV22DC80-1 Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F. |
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High peel and shear strength single component nickel filled epoxy adhesive. Thixotropic system. Cost effective electrical conductivity. Resists from 4k to +400°F. |
