Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
One Component, UV and Heat Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation. Dual Cure System Allows for Curing in “Shadowed Out” Areas.
Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.
Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties. Meets USP Class VI Specifications.
