Heat Cure

EP30DPSP Product Information

EP30DPSP Two Part Epoxy

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

Supreme 3HTND-2DM Product Information

Supreme 3HTND-2DM One Component Epoxy

One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.

EP110F8-5 Product Information

EP110F8-5 Two Part Epoxy

Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.

UV15-7DCNV Product Information

UV15-7DCNV One Part UV System

One Component, UV and Heat Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation. Dual Cure System Allows for Curing in “Shadowed Out” Areas.

EP110F8-3 Product Information

EP110F8-3 Two Part Epoxy

Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.

EP110F8-1 Product Information

EP110F8-1 Two Part Epoxy

Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.

EP62-1LPSPMed Product Information

EP62-1LPSPMed Two Component Epoxy

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance

X21Med Product Information

X21Med One Component Elastomeric System

High Performance Elastomer Based One-Component Adhesive for Fast Durable Bonding and Sealing of Polyolefins without Surface Pretreatment.

EP29LPHE Product Information

EP29LPHE Two Component Epoxy

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

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