One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
Low Viscosity, Optically Clear Two Component Room Temperature Curing Epoxy Resin System for High Performance Bonding, Casting and Coating Applications Featuring Exceptionally Long Working Life and Low Exotherm
High Performance Low Viscosity, Flexible Optically Clear Epoxy System for Large Castings, Sealing & Bonding Featuring Exceptionally Long Working Life and Low Exotherm During Cure.
Low Viscosity, Fast Curing, Two Component, High Performance Optical Epoxy for Bonding, Sealing, Coating and Casting Featuring Excellent Chemical Resistance.
