Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
Two Component, Graphite Filled Electrically Conductive Silicone Compound For High Performance Bonding And Sealing Cures To A Tough Flexible Electrical Conductive Black Rubber
Two Component, Room Temperature Curing, Stainless Steel Filled Epoxy Resin System for Repair, Rebuilding, Restoring and Resealing of Worn or Damaged Metallic Components and High Compressive Strength Bonding of Carbide to Steel
One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Electrically Insulating Epoxy Featuring Excellent Bonding and Physical Strength Properties, Along with a Superior Ability to Withstand Thermal Cycling. Cryogenically Serviceable. Requires Oven Curing.
