Electrically Insulative

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.

Two Component Electrically Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

Versatile Two Component, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation and Casting.

Conforms to FDA Chapter 1, Section 175.105 for Indirect Food Applications.

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.