EP37-3FLFAN Product Information

EP37-3FLFAN Two Part Epoxy System

Two Component, Room Temperature Curing, Highly Thermally Conductive, Electrically Isolating Epoxy For Potting, Bonding, Sealing & Coating Featuring Flexibility and Low Viscosity.

EP37-3FLFAO Product Information

EP37-3FLFAO Two Part Epoxy

Two component epoxy compound for potting, bonding, sealing and coating

EP37-3FLSP Product Information

EP37-3FLSP Two Component Epoxy

High Performance Low Viscosity, Flexible Optically Clear Epoxy System for Large Castings, Sealing & Bonding Featuring Exceptionally Long Working Life and Low Exotherm During Cure.

EP38 Product Information

EP38 Two Component Epoxy

Two component epoxy for potting, bonding, sealing and coating

EP39-2 Product Information

EP39-2 Two Part Epoxy

Low Viscosity, Fast Curing, Two Component, High Performance Optical Epoxy for Bonding, Sealing, Coating and Casting Featuring Excellent Chemical Resistance.

EP39-2LV Product Description

EP39-2LV Two Component Epoxy

Low Viscosity, Fast Curing, Two High Performance Optical Epoxy For Bonding, Sealing, Coating & Casting Featuring Excellent Chemical Resistance

EP39-M Product Description

Two Component, Low Viscosity Epoxy Adhesive/Sealant For High Performance Bonding Featuring Excellent Electrical Insulation Characteristics, High Thermal Stability and Superior Chemical Resistance.

EP39MHT Product Information

EP39MHT Two Part Epoxy System

Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F

EP3ANHT Product Description

EP3ANHT One Part Epoxy

One Component Abrasion, Thermal Shock and Heat Resistant Thermally Conductive Epoxy for Electrical Potting Encapsulation and Bonding

EP3AOHT Product Description

EP3AOHT One Part Epoxy

One Component Abrasion, Thermal Shock and Heat Resistant Thermally Conductive Epoxy for Electrical Potting Encapsulation and Bonding

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