Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Flexibilized For High Performance Bonding Featuring Exceptionally High Thermal Conductive
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity
Two Component Nickel Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Good Electrical Conductivity and High Flexibility.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing
