Low Viscosity

EP114 Product Information

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

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EP3UF-1 Product Information

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

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X18Med Product Information

High Performance Elastomer Based One-Component Adhesive for Fast Durable Bonding and Sealing of Polyolefins without Surface Pretreatment.

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EP30DPSP Product Information

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

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UV15-7DCNV Product Information

One Component, UV and Heat Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation. Dual Cure System Allows for Curing in “Shadowed Out” Areas.

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UV15-7NV Product Information

One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.

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EP110F8-3 Product Information

Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.

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EP110F8-1 Product Information

Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.