One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
