EP39-M Product Description

Master Bond Polymer System EP39-M is a low viscosity, two component, epoxy adhesive/sealant for high performance bonding featuring excellent electrical insulation characteristics, high thermal stability and superior chemical resistance. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient hundred (100) to seventy-five (75) mix ratio by weight. The Master Bond Polymer System EP39-M is 100% reactive and does not contain any solvents or other volatiles. Shrinkage after cure is exceptionally low,0.0005 to 0.0003 in/inch depending upon the curing conditions employed. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit excellent electrical insulation characteristics, even upon exposure to adverse environmental conditions at both ambient and elevated temperatures in the presence of water and other chemicals as well as durable high bonding strengths.

Master Bond Polymer System EP39-M is based on a novel polyfunctional epoxy resin and a uniquely modified cycloaliphatic polyamine hardener. It produces high strength and tough bonds with exceptional