Two Component Epoxy Adhesive For High Performance Bonding, Sealing and Encapsulation
Two Component Epoxy Adhesive For High Performance Bonding, Sealing and Encapsulation
Master Bond Polymer Adhesive EP21HV is a two component epoxy adhesive for high performance bonding, sealing and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250 F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A clear, part B amber. Master Bond EP21HV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is 100% reactive and does not contain any diluents or volatiles.
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- Epoxy |
- Chemically Resistant |
- Dimensionally Stable |
- Electrically Insulative |
- Thermal Cycling Resistant |
- Heat Cure |
- Room Temperature Cure |