General Considerations
- What surfaces will be bonded?
- What is the bond area geometry?
- What bond line thickness is required?
- What bond strength is needed?
- What physical forces will effect the joint?
- Is a rigid or a flexible bond desired?
- Will the assembly be exposed to high or low temperatures?
- Will the bond be exposed to temperature cycling?
- Will the bond be exposed to mechanical shock and vibration?
- Will the bond be exposed to water, inorganic or organic chemicals?
- Should the bond exhibit good electrical insulation properties?
- Will the bond need to be thermally or electrically conductive?
- What color bond is needed?
- What storage conditions and shelf life are required?
Dispensing Considerations
- What packaging is preferred?
- Do you need a high viscosity or low viscosity adhesive?
- How much adhesive is needed per assembly?
- How many parts will be bonded?
- Do you want to apply the adhesive manually or automatically?
- Do you want the dispenser to be disposable or permanent?
- How quickly should the adhesive be dispensed?
- Should adhesive be dispensed in a dot, bead or shot?
- How accurately should the adhesive be dispensed and placed on the substrate?
Curing Considerations
- How much adhesive is cured per application?
- What is the bondline thickness?
- Do you prefer a faster, elevated temperature cure?
- How fast of a cure is needed?
- What handling time is desirable?
- How quickly will the bonded assembly be put into service?
