Master Bond Product Search

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EP29LPHT Two Part Epoxy System EP29LPHT

Low viscosity, optically clear epoxy for bonding, sealing, potting. Room temperature curing. Superior dielectric properties. Serviceable from -60°F to +300°F. Cures rigid. Long working life. Low shrinkage upon cure. Ideal for large volume potting.

EP29LPSP Two Part Epoxy EP29LPSP

Two part epoxy system with ultra low viscosity and remarkable cryogenic properties. Withstands rapid drop in temperature and is NASA low outgassing approved. Optically clear. Long working life. Low exotherm. Excellent resistance to acids, bases and many solvents. Outstanding electrical insulative properties. Service operating temperature range from 4K to +275°F.

EP29LPSPAO Two Part Epoxy EP29LPSPAO

Low exotherm potting/encapsulation compound. Heat curing two component thermal conductive/electrical insulative system. Can withstand cryogenic shocks. Superior electrical insulation properties. Good chemical resistance. High dimensional stability. Vacuum compatible. Service operating temperature range from 4K to +275°F.

EP29LPSPAO-1 Black Two Part Epoxy EP29LPSPAO-1 BLACK

Thermally conductive/electrically insulative epoxy for bonding, sealing, potting. Good flow properties. Serviceable from 4K to +250°F. Can withstand cryogenic shocks. High dimensional stability. Complies with NASA low outgassing specifications. Black color.

Two Part Epoxy System EP29LPSPND-3 EP29LPSPND-3

Two part epoxy system with paste consistency and remarkable cryogenic properties. Withstands rapid drop in temperature. Long working life. Low exotherm. Excellent resistance to acids, bases and many solvents. Outstanding electrical insulative properties. Service operating temperature range from 4K to +250°F.

Two Part Epoxy EP29LPTCHT EP29LPTCHT

Two component epoxy featuring a low viscosity with excellent flow properties. It is electrically insulative and thermally conductive with an impressive fine particle size filler material. Bond line thicknesses range from 5 to 15 microns.

EP30 Two Component Epoxy Adhesive System EP30

Low viscosity two part high performance epoxy resin system. High strength rigid bonds. Low linear shrinkage after cure. Superb optical clarity and light transmission properties. Serviceable from -60°F to +250°F. Cures readily at room temperature. Withstands 1,000 hours 85°C/85% RH.

EP30-1LP Two Part Epoxy System EP30-1LP

Ultra low viscosity two component epoxy system. 100% reactive. Excellent optical clarity and light transmission properties. Ability to fill small gaps. High strength. Versatile cure schedules. Rigid bonds. Low shrinkage. Service operating temperature range from -60°F to +250°F.

EP30-1NV

Low viscosity two part high performance epoxy resin system. High strength rigid bonds. Low linear shrinkage after cure. Superb light transmission properties. Serviceable from -60°F to +250°F. Cures readily at room temperature.

EP30-2 Two Part Epoxy Compound EP30-2

Cryogenically serviceable. NASA low outgassing approved. 100% reactive. Excellent light transmission properties. Outstanding dimensional stability. High tensile and compressive strength. Successfully tested for 1,000 hours 85°C/85% RH. Excellent dielectric properties. Serviceable from 4k to +300°F.

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