Expanded Product List
Master Bond Product Search
552 products match
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EP3RR-1 Thermally conductive/electrically insulative epoxy formulation for potting/encapsulation and underfill applications. No mix system. Rapid curing with versatile cure schedules Good flow properties. Dimensionally stable. Available in syringes for manual or automatic dispensing. Serviceable from -60°F to +350°F. |
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EP3RR-80 Moderate viscosity with excellent flow properties. One part system featuring cures at 80°C or higher. Superior thermal conductor. Excellent electrical insulator. Low exotherm while curing. Outstanding mechanical strength properties. Withstands 1,000 hours 85°C/85% RH. Passes NASA low outgassing tests. Serviceable from -100°F to +350°F. |
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EP3RRLV One part oven cured system (125-150°C) for potting, encapsulation and underfill applications. Good dimension stability and very easy to use. Cures rigid. Thermally conductive/electrically insulative. Excellent flow properties. Superior mechanical strength. Can be cast up to 1 inch thick. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +350°F. |
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EP3SP5FL Single component snap cure adhesive. Unsurpassed curing speed of 1-2 minutes at 300°F. Moderate viscosity with good flow properties. Easy to dispense. Good tensile lap shear strength. Repairable. Serviceable from -60°F to +200°F. |
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EP3SP5FL-ND2 Snap cure epoxy adhesive. Paste viscosity. Cures in 1-2 minutes at 300°F. Readily reworkable. Good bond strength and electrical insulation properties. Serviceable from -60°F to +200°F. |
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EP3UF One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP3UF-1 One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP40 Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F. |
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EP40Med Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F. |
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EP40ND Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. For bonding, potting, sealing compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -100°F to +250°F. Paste consistency. |