Expanded Product List
Master Bond Product Search
552 products match
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Supreme 11AO Thermally conductive/electrically isolating epoxy adhesive/sealant. Ambient temperature curing. Convenient one to one mix ratio by weight or volume. Thick paste. High peel and shear strength. Toughened system. Well suited for bonding dissimilar substrates. Service temperature range -100°F to +250°F. |
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Supreme 11AOHT Thermally conductive, electrically insulative epoxy adhesive. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High peel and shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. |
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Supreme 11AOHT-LO Passes NASA low outgassing tests. Thixotropic paste viscosity. Convenient one to one mix ratio by weight or volume. High thermal conductivity. Excellent electrical insulation properties. Dimensionally stable. Withstands 1,000 hours 85°C/85% RH. Toughened system. Ability to resist rigorous thermal cycling. Service temperature range -112°F to +400°F. |
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Supreme 11AOHTLP Thermally conductive, electrically insulative epoxy adhesive. High peel and shear strength properties. Non-drip system. Resists -100°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. Long working life. |
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Supreme 11AOHTMed Thermally conductive, electrically insulative epoxy adhesive. Meets ISO10993-5 for cytotoxicity. High lap shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight. Versatile cure schedules. |
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Supreme 11HT High peel and shear strength system. Convenient one to one mix ratio. Serviceable from -100°F to +400°F. Superior resistance to impact, thermal shock, vibration and stress fatigue cracking. Excellent toughness. Cures readily at room temperature. User friendly. Dependable dimensional stability. Readily machinable. |
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Supreme 11HT-3A Service temperature from -100°F to +400°F. High bond strength to similar and dissimilar substrates. Excellent durability, toughness, impact resistance. Convenient 100 to 50 mix ratio by weight. Withstands prolonged exposure to water, oils, fuels and most organic solvents. Aramid fiber reinforcements assures outstanding dimensional stability. |
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Supreme 11HT-4 Two component, high strength epoxy adhesive. Serviceable for -100°F to +400°F. Excellent electrical insulation characteristics. Adheres well to similar/dissimilar substrates. Aramid fiber reinforcement for dimensional stability. Exceptional durability. 100 to 40 mix ratio by weight. Versatile cure schedules. |
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Supreme 11HT-LO Room temperature curing epoxy adhesive has a convenient one to one mix ratio. High shear and peel strength. Toughened. NASA low outgassing approved. Stress cracking fatigue resistant. Serviceable from -100°F to +400°F. Withstands 1,000 hours 85°C/85% RH. Fast setting. Good flow. Easy to apply. |
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Supreme 11HTLP High viscosity, two component, toughened epoxy adhesive/sealant. One to one mix ratio weight or volume. Favorable open time. Cure readily at room temperature. Outstanding toughness. High shear/peel strength. Resists impact, shock, thermal cycling. Serviceable from -100°F to +400°F. |