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EP21HTND Product Information | MasterBond.com

Two component epoxy compound for bonding, sealing and coating

EP21HTND Two Component Epoxy Adhesive

Key Features

  • Two component, room temperature curing epoxy
  • Excellent adhesion to a wide variety of substrates
  • Meets FDA Section 175.105 for food applications
  • Resists up to +400°F
  • One to one mix ratio
  • Non-drip consistency
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