Fast Curing, Two Component Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio, Exceptionally High Thermal Conductivity, and Excellent Electrical Insulation Properties.
Fast Curing, Two Component Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio, Exceptionally High Thermal Conductivity, and Excellent Electrical Insulation Properties.
Master Bond Polymer Adhesive EP24AN is a fast curing two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft2 •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1600 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP24AN offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP24ANLV is also available. The rapid cure of EP24AN makes it a highly desirable system for many field applications. In this regard, EP24AN possesses the highly unusual property of curing at temperatures as low as 20°F.
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- Epoxy |
- Dimensionally Stable |
- Electrically Insulative |
- Thermal Cycling Resistant |
- Thermally Conductive |
- Heat Cure |
- Fast Cure |
- Room Temperature Cure |