EP34AN Product Description

Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio of 100/70, by weight. Physical properties are maintained even after long exposure to temperatures in the 400-450°F range. Master Bond Polymer System EP34AN is easily mixed and can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. A lower viscosity version called EP34ANLV suitable for potting and encapsulation is available, as well as a special low outgassing version, EP34AN-1.

EP34AN is resistant to repeated thermal cycling and resists chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to 450°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured epoxy is a superior electrical insulator. Color of part A tan, part B amber. Master Bond Polymer System EP34AN offers thermal conductivity along with the convenience of a room temperature cure with high temperature resistance and is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries.