Master Bond EP51CC is a high performance epoxy featuring rapid set up time, convenient handling, and good physical properties. It is a nondrip system with a forgiving mix ratio of one to one by weight or volume. Most significant, it is color coded with Part A being white, Part B black, and when fully mixed, it turns uniformly gray. The presence of streaks would denote incomplete mixing. The working life is about 3 to 5 minutes for a 50 gram mass. The fixturing time is generally about 10 to 15 minutes depending upon the application. These times are mass dependent and mixing smaller amounts will allow for a slightly longer open time. After curing, it has excellent physical strength properties. The system has no solvents or diluents and very low shrinkage.
EP51CC can be applied with a gun dispenser. The two parts combine into a smooth, uniform gray color paste.
The compound sets up very quickly at room temperature, with a working life of 3-5 minutes for a mixed 50 gram batch. The exact fixture time for each application context can vary, depending on multiple factors including, but not limited to the size of the components, the substrates being bonded, curing temperature and the amount of adhesive applied.
EP51CC bonds well to metals, composites, glass, ceramics, vulcanized rubbers, and many plastics. It can withstand rigorous thermal cycling as well as thermal shock. EP51CC is electrically and thermally isolating. The temperature range is from 4K to +250°F and this epoxy can be used in a number of cryogenic applications. An interesting feature is that it can be mixed and cured at temperatures as low as 50-60°F. Although EP51CC cures much slower than it does at ambient temperatures, it will fully cure in 3-5 days. This is a versatile system that can be used in standard OEM, aerospace, optical, electronic, cryogenic, and field applications where easy handling, fast curing and good physical strength properties after cure are desirable.
Product Advantages
- Non-critical one to one mix ratio by weight or volume
- Easy to apply, paste like consistency
- High bond strength to a wide variety of substrates
- Can be packaged for use in field applications
- Serviceable at cryogenic temperatures down to 4K
