Heat Cure

EP21ND Product Information

EP21ND Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP21ND-2 Product Information

EP21ND-2 Two Part Epoxy

Two Component Non-Drip Epoxy for High Performance General Purpose Bonding, Sealing, and Coating

EP21ND-LO Product Information

EP21ND-LO Two Part Non-Drip Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.

EP21Q Product Description

EP21Q Two Part Epoxy

Two Component Quartz Filled Epoxy System For High Performance Bonding, Coating and Sealing with Enhanced Corrosion And Abrasion Resistance

EP21SL5 Product Description

EP21SL5 Two Part Epoxy

Two Component, High Performance Epoxy Resin System For Bonding Teak And Other Wood Products

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

EP21TDC Product Information

EP21TDC Two Component Epoxy

Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

EP21TDC-2 Product Information

EP21TDC-2 Two Part Epoxy

Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.

EP21TDC-2AN Product Information

EP21TDC-2AN Two Part Epoxy

Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP21TDC-2AO Product Information

EP21TDC-2AO Two Part Epoxy

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

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