EP21TDCN Product Information

EP21TDCN Two Part Epoixy System

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP21TDCNFL Product Information

Two Component Nickel Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Good Electrical Conductivity and High Flexibility.

EP21TDCS Product Information

EP21TDCS Two Part Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.

EP21TDCS-LO Product Information

EP21TDCS-LO Two Part Adhesive System

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing

EP21TDCSFL Product Information

EP21TDCSFL Two Part Conductive Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.

EP21TDCSMed Product Information

EP21TDCSMed Two Part Medical Grade Epoxy

High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications

EP21TPHTAO Product Description

EP21TPHTAO Two Part Polysulfide/Epoxy

Two Component Thermally conductive Polysulfide/Epoxy Adhesive/Sealant For High Performance Bonding and Sealing

EP22 Product Information

EP22 Two Part Epoxy Adhesive System

Aluminum Filled, Tough, Two Component Epoxy Adhesive for High Performance Bonding, Sealing and Coating with Enhanced Machinability and First Class Dimensional Stability.

EP22P Product Description

Two Component Metallic Epoxy Compound For Repair Of Damaged Metal Structures

EP23 Product Description

Mineral Filled Two Component Epoxy Adhesive For High Performance Bonding And Sealing With Enhanced Dimensional Stability

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