One component “snap cure” epoxy adhesive
One component, thermally conductive epoxy adhesive
Two part, thermally conductive, electrically insulative epoxy for bonding and sealing featuring outstanding heat resistance; requires oven curing
One component epoxy system for impregnation, sealing and coating
Toughened, two component epoxy for bonding, sealing and coating
Two component, highly flexibilized epoxy for bonding, sealing and coating
Two component epoxy compound for high performance applications
Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation
Two component high performance epoxy for bonding, sealing, coating and encapsulation
Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
