One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.
One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 650°F.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
