Chemically Resistant

EP46HT-1ND-2 Product Information

EP46HT-1ND2 Two Part Epoxy System

Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.

EP46HT-2ND2 Product Information

EP46HT-2ND2 Two Part Epoxy Compound

Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.

EP3RR-80 Product Information

EP3RR-80: One Part Epoxy System

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP21HT-LO Product Information

EP21HT-LO Two Part Epoxy System

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP62-1LPSP Product Information

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance

EP46CA-1 Product Information

EP46CA-1 Two Part Epoxy

Two component epoxy for structural bonding featuring superlative heat resistance; requires oven curing.

Supreme 45HTND-2 Product Information

Supreme 45HTND-2 Two Part Epoxy

Two Component, High Temperature Resistant Epoxy System for High Performance Bonding, Sealing and Coating Featuring Superior Thermal Cycling Capabilities.

EP41S-LO Product Information

EP41S-LO Two Part Epoxy Compound

Two Component Epoxy Resin System for Durable, High Performance,
High Strength Coatings, Liners and Sealants Featuring Chemical Resistance and Fast Cure.

EP21TDC-2LOND Product Information

EP21TDC-2LOND Two Part Epoxy Compound

Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.

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