Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
One Component Epoxy System for Bonding, Sealing, Coating and Casting. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F. Qualifies to NASA ASTM E595 for low outgassing.
Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F. Meets NASA low outgassing specifications.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Well Suited for Resisting a Wide Variety of Chemicals at Higher Temperatures.
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation. Magnificent Structural Adhesive Properties and Exceptional Thermal Cycling Capabilities.
