Chemically Resistant

EP19HT Product Information

EP19HT One Component Epoxy System

One Component, Storage Stable Epoxy Resin System for Durable High Performance Adhesive/Sealants, Impregnants and Liners

EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21 Product Information

EP21 Two Component Epoxy Compound

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

EP21AN Product Information

EP21AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant & Coating Featuring a Convenient One to One Mix Ratio, Exceptionally High Thermal Conductivity and Excellent Electrical Insulation Properties.

EP21AOLV-1 Product Information

EP21AOLV-1 Two Part Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

EP21AR Product Information

EP21AR Two Component Epoxy System

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids.

EP21ARHT Product Information

EP21ARHT Two Part Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.

EP21CLV Product Information

EP21CLV Two Part Adhesive

Two Component Epoxy System Featuring Easier Handling and Exceptional Versatility for High Performance Bonding, Sealing, Coating and Encapsulation

EP21FL Product Information

EP21FL Two Part Epoxy

Low Viscosity, Toughened, Two Component Epoxy System for High Performance Bonding, Sealing and Encapsulation, Capable of Withstanding Rigorous Thermal Cycling; Very Low Exotherm and Exceptionally Long Working Life.

EP21HT Product Information

EP21HT Two Part Epoxy System

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

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