EP29LP Product Information

EP29LP Two Component Epoxy

Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP30-3 Product Information

EP30-3 Two Part Epoxy Compound

Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F.

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30AOSP Product Description

EP30AOSP Two Part Epoxy

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy For Potting, Bonding, Sealing & Coating Featuring Low Viscosity

EP30C Product Information

EP30C Two Part Epoxy

Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.

EP30D-7 Product Information

EP30D-7 Two Part Urethane Modified Epoxy System

Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation

EP30FL Product Information

EP30FL Two Part Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.

EP30HT Product Information

EP30HT Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.

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