Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.
Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.
Two Component, Highly Flexible Epoxy for High Performance Bonding, Sealing and Coating, Features Outstanding Adhesion to Rubbers and Other Substrates, Long Working Life and Higher Viscosity.
Two Component, Highly Flexible Two Part Epoxy For High Performance Bonding, Sealing and Coating Featuring Outstanding Adhesion to Rubbers and Other Substrates
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.
Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity
