Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.
Two Component, Room Temperature Curing Epoxy Resin for Bonding, Coating, Sealing and Potting Offers Outstanding Non-Yellowing Characteristics; Featuring Low Viscosity. ISO 10993-5 for cytotoxicity.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets ISO 10993-5 Specifications.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Flowable, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.
