Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical Resistance is NASA low outgassing approved.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance for Medical Device Manufacturing.
Optically Clear, Two Component Epoxy Adhesive for High Performance Bonding, Coating, Sealing and Casting Featuring Superior Non-Yellowing Properties, Low Viscosity and Rapid Curing for Medical Device Assembly.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Two Component, Flexible, Low Viscosity Epoxy Compound Meets ISO 10993-5 certification. Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Excellent Adhesion To Engineering Plastics And Metals, Polycarbonates And Acrylics
One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.