One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Completely at 405 nm Wavelength up to 1/8 Inch Thick; Cures Tack-Free Without Any Oxygen Inhibition; Excellent Physical Properties.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Paste Consistency, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures
One Component, Room Temperature Curing Silicone Elastomer Adhesive for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.Meets MIL-A-46146 Type 2.
One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy and Very Fast, Non-Corrosive Cure.
Two Component, Low Viscosity Epoxy System for Bonding, Sealing, Coating and Encapsulation with Excellent Physical and Electrical Insulation Properties. Featuring Superb Optical Clarity and Light Transmission.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.
Two Component, Room Temperature Curable, High Temperature Resistant Epoxy System, Sealant, Coating and Casting System Resists Multiple Cycles of Medical Sterilization Including Radiation, Chemicals and Steam.
Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
