Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Meets NASA Low Outgassing Specification ASTM E595.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Tack-Free Without Any Oxygen Inhibition. Meets USP Class VI Specifications; Also Passes ISO 10993-5 Cytotoxicity Test.
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.
Two Component, Room Temperature Curing Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offers Outstanding Chemical Resistance along with Superior Physical Strength Properties.
One Component, Moderate Viscosity LED Curable System Cures Readily and Tack-Free at 405 nm Wavelength up to 1/8 Inch Thick Without Any Oxygen Inhibition.
Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Superb Physical Properties and Enhanced Dimensional Stability, Temperature and Chemical Resistance.
