Fast Curing, Two Component Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio, Exceptionally High Thermal Conductivity, and Excellent Electrical Insulation Properties.
Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.