Flexibilized & Toughened

Supreme 3CCM-85 Product Information

Supreme 3CCM-85 One Component Epoxy Compound

One Component, Toughened Epoxy System Cures at 175-185°F.

Supreme 17HT Product Information

One Part Epoxy System

One component toughened epoxy system for bonding and sealing

EP88FL Product Information

Low viscosity, optically clear, two part epoxy adhesive

Two component, room temperature curing epoxy for bonding,coating, sealing and potting

Supreme 3HTS-80 Product Information

One component, silver conductive epoxy adhesive featuring high bond strength

One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.

MasterSil 151TC Product Information

MasterSil 151TC Two Part Silicone

Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.

MasterSil 170 Gel Product Information

MasterSil 170 Gel: Two part silicone encapsulant

Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.

Supreme 3ANLV-1 Product Information

Supreme 3ANLV-1 One Part Epoxy

One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity

Supreme 62-1 Product Information

Supreme 62-1 Two Part Epoxy

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance

EP114 Product Information

EP114 Two Component Epoxy

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

EP36FR Product Information

EP36FR One Component Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

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