Low Viscosity

Two Component Low Viscosity, Room Temperature Curing Epoxy System Featuring Exceptionally Long Working Life and Low Exotherm for Bonding, Sealing, Casting and Filament Winding

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.