Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance. Passes NASA Low Outgassing Tests.
Room Temperature Curing, Urethane Modified Epoxy Gel-Like System for Sealing and Encapsulation Cures To a Low Shore A Hardness Ideal for Retrievability
Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulation Featuring High Temperature Resistance, Good Dimensional Stability and Excellent Chemical Resistance.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Tack-Free Without Any Oxygen Inhibition. Meets USP Class VI Specifications; Also Passes ISO 10993-5 Cytotoxicity Test.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.
