One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.
Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock with a paste consistency.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance for Medical Device Manufacturing.
Toughened, Two Component, Room Temperature Curing Epoxy System for Bonding, Coating, Sealing and Encapsulation Featuring Abrasion Resistance and Cryogenic Serviceability.
One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
