EP51HT Product Description

Master Bond EP51HT represents a significant advance in epoxy adhesive technology featuring an excellent balance of performance properties, including convenient curing at ambient temperatures, and superior cost effective bonding performance for service from 4K to 400°F. This two component adhesive system is formulated to cure exceptionally fast (5 minute gels) at ambient temperatures or even more rapidly at elevated temperatures, with a convenient one to one mix ratio. EP51HT produces exceptionally good performance bonds with high shear strength, for service over a wide temperature range of 4K to as high as 400°F. It offers truly remarkable resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance desired for high performance and heat resistant bonding. EP51HT is easily mixed and can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any solvents or diluents.

EP51HT produces durable, high strength, exceptionally tough bonds which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposure at elevated temperatures. Tensile lap shear strengths as high as 3,000 psi are obtained after room temperature cure only and the bonds retain high strength properties when exposed to the 350-400°F range. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of Part A is clear, Part B is tan. EP51HT offers the convenience of a room temperature cure with a uniquely favorable balance of performance properties for use in even the most demanding applications in the aerospace, electronic, electrical, computer, construction, appliance, automotive and chemical industries for service up to 400°F.

Product Advantages

• Convenient mixing: non-critical one to one mixing ratio, by weight.
• Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly.
• No-drip formula available (EP51HTND).
• Versatile cure schedules: exceptionally fast ambient temperature cure or high speed elevated temperature cures as required.
• High bonding strength to similar and dissimilar substrates over the remarkably wide temperature range of 4K to +400°F.
• Good electrical insulating properties and chemical resistance.
• Superior thermal shock, impact and stress cracking fatigue resistance.
• Excellent long term durability and dimensional stability.